Die bonder manual

Thermo Compression bonding is the key technology for current D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications. The Datacon TC advanced sets the new benchmark based on the proven concept with total process control, advanced capabilities and unsurpassed production stability. Mech-El Manufacturer: MEI Mech-El MECH-EL EUTECTIC DIE BONDER The Mech-El/MEI is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI uses a un. die bonder, die attach.

Model UDBB Manual Eutectic Die Bonder bonds devices using heat and vibration at an ultrasonic frequency. It provides precise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistant wetting without damaging die. Multi-Purpose Manual Die Bonder The FINEPLACER ® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in RD labs and universities. The T Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils highest requirements for up- to-date applications in RD and small scall productions of the worldwide microelectronic industry.

53xx BDA Manual Universal Fine Wire Die Bonder. The 53xx BDA offers two bond processes in one machine. Gold ball bonding and deep-access wedge bonding. The HB75 is a bench top size diebonder, ideal for laboratories and pilot production lines. It is equipped with a double head for die-placement and for epoxy. Manual / Semi-Automatic Die Bonders. Die bonding, Flip Chip Bonding, Ultrasonic Die Bonding, Eutectic Bonding. Everything is possible with.